Aluminum PCB Capacity

                             铝                       
                                      Main Characteristics of Aluminum-based Coppper-clad Laminate
Test itemIndex ValueTest ValueTest Method
N/mm1.82.2GJB16514010
Peet strength
绝缘电阻1*10 g10 gGJB16515020
Insulation Resistance(w)
穿 DC Kv46 GJB16515040
 Breakdown Voltage (Vdc)
介质损耗角正切(1MHz0.030.0240,93%96h
Dielectric Loss Angle Tangent
1MHz4.43.540,93%96h
Dielectric Constant 1MHz
               Soakable Soldering (/W)2min260288GB/T472217
不起泡不起泡
No BubbleNo Bubble
不分层不分层
No DelaminationNo Delamination
FV-OFV-OGB/T472226
 Flammability
/W1.51TO-220
Heat Resistance (/W)

 

                   
Aluminum-based PCB Techinic
项目技术指标
ItemTechnical Parameter
最大加工面积单面/双面 
Max.Board SizeSingle/Double 450x450
板厚  Board Thickness0.3~3.0mm
最小线宽 Min.Track Width0.15mm
最小间距 Min.Space0.15mm
最小孔径 Min. Hole Size0.5mm
孔壁铜厚 PTH Wall Thickness0.02mm
金属化孔公差φ0.8mm±0.05mm
PTH Dia Toleranceφ0.8mm±0.08mm
非金属化孔公差φ0.4mm±0.05mm
NPTH Dia Toleranceφ0.4mm±0.1mm
孔位公差 Hole Position Tolerance±0.05mm
外形尺寸公差 Outline Tolerance±0.2mm
绝缘电阻 Insulation Resistance1012Ω(常态 normal condition)
抗电强度 Dielectric Strength1.3kv/mm
抗剥强度 Peel-off Strength1.4N/mm
金属化孔拉脱强度 Metals Peel-off Strength
阻焊剂硬度 Solder Mask Abrasion5H
热冲击 Thermal Stress2655
可燃性 Flammability94V-0
最高工作温度 Tallest Work Temperature125
翘曲度 Bow and Twist0.01mm/mm

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